Service

Semiconductor

At AES, we recognize the transformative role the semiconductor industry plays in driving technological innovation. Our specialized consulting services are tailored to meet the unique challenges of this dynamic sector, enabling semiconductor companies to stay ahead in a rapidly evolving marketplace. Product engineering is a key driver of revenue, helping clients expand their market share through product success. We achieve this by prioritizing our customers’ needs above all else. We value product over project, risk over reward, relationships over transactions, and collaboration over services. Unlike many other service companies, we listen, innovate, and adapt to meet our customers’ evolving needs. Our mission is to transform product ideas into viable market solutions through technological innovation.

AES offers consulting, augmentation and RPO for full semiconductor product cycles including digital IC design, FPGA, ASIC, SoC, digital ASIC and SoC verification. Some of our semiconductor industry services includes

Semiconductor Equipment's of Specialization

  • Loadlock particle tracking & CFD flow simulation
  • Boiler design for wafer cleaning
  • Reticle stocker structural design
  • Thermal management of shower head
  • Electrostatic chuck – Heater trace and cooling channel design
  • Graphic cards thermal management and  contact pressure studies.
  • Plasma simulation
  • Electronic Power Steering(EPS) power pack thermal management & structure design.

Electronics Cooling and Packaging

  • ASIC, Microprocessor, Mosfet, Diodes, Layered board, Motor windings, Thermal analysis and performance evaluation.
  • Heat sink design; P-Q evaluation
  • TIM material selection
  • ASIC lidded package
  • Heat path design and optimization.
  • Thermal management by Thermal and CFD
  • Thermo-structural CTE Mismatch studies
  • Prestressed modal, Shock & Vibration
  • Solder BGA plastic work studies
  • Board contact pressure studies
  • EDA bridging

Semiconductor design, verification and consulting

  • Electronic Cooling & Packaging
  • Cooling System for Semiconductor Industries
  • ASIC design
  • SoC & FPGA design
  • Physical and custom IC design
  • Embedded system development
  • DFT & Device drivers
  • VLSI design & verification – UVM,VMM,OVM,SPECMAN
  • Core IP Services-design and deployment – network, optical, IoT ,wireless, AI, machine learning, memory, flash controller, interfaces
  • Analog, Memory & Board design
  • Hardware design simulation and emulation – HAPS, Veloce, Paladium, Zebu

Semiconductor Simulation Capabilities

For over 20 years, AES has provided CAE services to the semiconductor industry, playing a significant role in its core business. We serve leading companies such as Nvidia, Lam Research, Applied Materials, Velodyne Lidar, Fralock, Technetics, Daktronics, DOLBY, Boston Scientific, BARCO, and many more.

AES Domain Expertise in Semiconductor

  • Thermal management by Thermal and CFD
  • Thermo-structural CTE Mismatch studies
  • Prestressed modal, Shock & Vibration
  • Trace Design for uniform heating for ESC
  • Cooling channels design for ESC
  • Heater design for Cryogenic application
  • Boiler design for Wafer cleaning
  • Microprocessor, Mosfet, Diodes, Layered board Thermal analysis
  • Heat sink design
  • Solder BGA plastic work studies
  • Board contact pressure studies.

Insights

Particle Tracking and Inspection in Semiconductor Equipments

Particle Tracking and Inspection in Semiconductor Equipments

Particle Tracking and Inspection in S...

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Boiler Simulation

Boiler Simulation

Boiler Simulation

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Pretension Modal Analysis of Nvidia Jetson Nano

Pretension Modal Analysis of Nvidia Jetson Nano

Pretension Modal Analysis of Nvidia J...

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Simulation driven design for fenestration industry

Simulation driven design for fenestration industry

Simulation driven design for fenestra...

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PCIe Card Thermal Management

PCIe Card Thermal Management

PCIe Card Thermal Management

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Heat and Cooling Channel Design – Analysis for an Electrostatic chuck

Heat and Cooling Channel Design – Analysis for an Electrostatic chuck

Heat and Cooling Channel Design ̵...

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Sensitivity study of Remote robotic controller joint assembly

Sensitivity study of Remote robotic controller joint assembly

Sensitivity study of Remote robotic c...

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Structural analysis of hardware on frames for fenestration industry

Structural analysis of hardware on frames for fenestration industry

Structural analysis of hardware on fr...

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How to Choose the Right Electric Motor for Small and Mid-Size EVs

How to Choose the Right Electric Motor for Small and Mid-Size EVs

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High-Performance Engineering Starts with High-Quality CAD

High-Performance Engineering Starts with High-Quality CAD

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How to Set Up an EV Charging Station That Meets Power and Site Requirements

How to Set Up an EV Charging Station That Meets Power and Site Requirements

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EV Fire Safety Engineering: Latest Standards & Simulation Approaches (2026 Update)

EV Fire Safety Engineering: Latest Standards & Simulation Approaches (2026 Update)

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Design Validation of IoT Devices under Thermal & Vibration Loads

Design Validation of IoT Devices under Thermal & Vibration Loads

Design Validation of IoT Devices unde...

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Why Liquid Cooling Works Better than Air Cooling for EV Battery Thermal Management

Why Liquid Cooling Works Better than Air Cooling for EV Battery Thermal Management

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Vibration Analysis of Automated Manufacturing Systems

Vibration Analysis of Automated Manufacturing Systems

Vibration Analysis of Automated Manuf...

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The Strategic Importance of Vehicle Packaging in Automotive Development—A Technical Perspective

The Strategic Importance of Vehicle Packaging in Automotive Development—A Technical Perspective

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