Objective:
To design an Electrostatic Chuck heater, which will have a uniform heating of wafer with a temperature difference of **% of the maximum temperature. To design an air cooling chamber so as to reduce the temperature to **°C with cooling rate of **°C per min.
Benefits:
Air cooling units are used to achieve desired cooling instead of water cooling units.
It saves liquid handling cost and high tolerances ,special gaskets are not required.
Final prototype was build, tested and compared with CFD results and found close correlation.
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