Modern Electronic Systems have become more compact, complex and operated at higher power range.
Due to high power consumption of the components and increase in power density for high-performance chips, they produce more heat. This heat has to be removed from the system to increase its performance and reliability.
For efficient thermal management some active cooling methods are implemented to handle high rate of power being dissipated. Generally in many applications air cooling solutions are adopted and must be optimized to remove the excess heat.
Liquid Cooling enables high heat transfer from CPU ,GPU, VGA packages, IGBT and other electronic components with low thermal resistance.
Direct-to-chip cold plates sit atop the board’s heat-generating components (CPUs, GPUs, memory modules) to draw off heat through single-phase cold plates or two-phase evaporation units. Liquid-cooled cold plates are commonly used for high heat flux or high power electronics cooling applications.
Tags: ThermalManagement, Thermal, CFD, CAE, CoolingSystem, LiquidCooling, Electronics, Electronics Engineering
