Service

Semiconductor

Product engineering is a revenue function and we help clients increase their wallet size through the success of the product. And we do this by putting our customer’s needs ahead of ours. We value product over project, risk over reward, relationship over transaction, and more importantly collaboration over services. Unlike many other services companies in the market, we listen, innovate, and adapt to the needs of our customers. Our goal is to unleash the product ideas, through technological innovations, into viable solutions for the market. AES offers consulting ,augmentation and RPO for full semiconductor product cycle includes digital IC design , FPGA, ASIC , SoC , digital ASIC and SoC verification . All our VLSI services are supported by highly focused and experienced talent.

Semiconductor

Creep Analysis of Lidar based sensor unit

Design of Electrostatic Chuck

ESC Chuck Air Cooling

Solder Paste Simulation

Thermal Analysis of Quartz tube

Electronic box Streamline plots

DTCU MEMS Chamber

TSSL Chamber Crack Propagation

Electro Thermal Analysis

Velocity vectors of Power pack

Electrostatic chuck Schematic

Electric Field on wafer Plot of Electrostatic chuck

Cooling Channel final of Electrostatic Chuck

Von-Mises stress plot of PCB

Heat Trace Final of Electrostatic Chuck

Electronic box Mesh

    Semiconductor design services and verification & consulting Services:
    • Electronic Cooling & Packaging
    • Cooling System for Semiconductor Industries
    • ASIC design
    • SoC & FPGA design
    • Physical and custom IC design
    • Embedded system development
    • DFT & Device drivers
    • VLSI design & verification - UVM,VMM,OVM,SPECMAN
    • Core IP Services-design and deployment -¬ network, optical, IoT ,wireless, AI, machine learning, memory, flash controller, interfaces
    • Analog, Memory & Board design
    • Hardware design simulation and emulation - HAPS, Veloce, Paladium, Zebu
    AES Domain Expertise in Electronics Cooling & Packaging:
    • ASIC, Microprocessor, Mosfet, Diodes, Layered board, Motor windings, Thermal analysis and performance evaluation.
    • Heat sink design; P-Q evaluation
    • TIM material selection
    • ASIC lidded package
    • Heat path design and optimization.
    • Thermal management by Thermal and CFD
    • Thermo-structural CTE Mismatch studiess
    • Prestressed modal, Shock & Vibration
    • Solder BGA plastic work studies
    • Board contact pressure studies
    • EDA bridging
    Semiconductor Equipment's of Specialization:
    • Electronic Power Steering(EPS) power pack thermal management & Structure Design.
    • Electrostatic chuck (ESC)
    • PCI e Cards Thermal management
    • Graphic Cards Contact pressure studies.
    Semiconductor Industry Simulation Capabilities:
    • AES has been offering CAE services to semiconductor industries for as long as 20 years and has been part of its the major business. It caters to companies like Apple, Nvidia, Lam Research, Applied Materials, Velodyne Lidar, NURO, Technetics, Daktronics, DOLBY, Boston Scientific, BARCO and so on.
    AES offers a range of solution for the Electronic and Semiconductor industry such as follows:
    • FEA analysis of Etch Chambers
    • Shock & Vibration Analysis of the PCB’s As per IEC-60068-2-27
    • Non linear, fatigue and creep analysis of Lidar based sensor units
    • Chamber Crack Propagation study
    • Electro Thermal Analysis
    • Heating and cooling phase Design / Analysis for an Electrostatic Chuck
    • CFD Thermal Analysis of Quartz tube
    • Chemical Etch Rate Prediction
    • Modeling of Electrochemical Reduction
    • Simulation of Electronic Box Cooling
    • Maximise Air Flow within the Electronic Box
    • CFD analysis in MEMS chamber
    • Solder paste simulation joining connector and PCB Board
    • Electrostatic chuck simulation

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