Service

Semiconductor

At AES, we recognize the transformative role the semiconductor industry plays in driving technological innovation. Our specialized consulting services are tailored to meet the unique challenges of this dynamic sector, enabling semiconductor companies to stay ahead in a rapidly evolving marketplace. Product engineering is a key driver of revenue, helping clients expand their market share through product success. We achieve this by prioritizing our customers’ needs above all else. We value product over project, risk over reward, relationships over transactions, and collaboration over services. Unlike many other service companies, we listen, innovate, and adapt to meet our customers’ evolving needs. Our mission is to transform product ideas into viable market solutions through technological innovation.

AES offers consulting, augmentation and RPO for full semiconductor product cycles including digital IC design, FPGA, ASIC, SoC, digital ASIC and SoC verification. Some of our semiconductor industry services includes

Semiconductor design, verification and consulting

  • Electronic Cooling & Packaging
  • Cooling System for Semiconductor Industries
  • ASIC design
  • SoC & FPGA design
  • Physical and custom IC design
  • Embedded system development
  • DFT & Device drivers
  • VLSI design & verification – UVM,VMM,OVM,SPECMAN
  • Core IP Services-design and deployment – network, optical, IoT ,wireless, AI, machine learning, memory, flash controller, interfaces
  • Analog, Memory & Board design
  • Hardware design simulation and emulation – HAPS, Veloce, Paladium, Zebu

Electronics Cooling and Packaging

  • ASIC, Microprocessor, Mosfet, Diodes, Layered board, Motor windings, Thermal analysis and performance evaluation.
  • Heat sink design; P-Q evaluation
  • TIM material selection
  • ASIC lidded package
  • Heat path design and optimization.
  • Thermal management by Thermal and CFD
  • Thermo-structural CTE Mismatch studies
  • Prestressed modal, Shock & Vibration
  • Solder BGA plastic work studies
  • Board contact pressure studies
  • EDA bridging

Semiconductor Equipment Specialization

  • Electronic Power Steering(EPS) power pack thermal management & Structure Design.
  • Electrostatic chuck (ESC)
  • PCI e Cards Thermal management
  • Graphic Cards Contact pressure studies.

Semiconductor Simulation Capabilities

For over 20 years, AES has provided CAE services to the semiconductor industry, playing a significant role in its core business. We serve leading companies such as Apple, Nvidia, Lam Research, Applied Materials, Velodyne Lidar, NURO, Technetics, Daktronics, DOLBY, Boston Scientific, BARCO, and many more.

AES offers a range of solution for the Electronic and Semiconductor industry such as follows:

  • FEA analysis of Etch Chambers
  • Shock & Vibration Analysis of the PCB’s As per IEC-60068-2-27
  • Non linear, fatigue and creep analysis of Lidar based sensor units
  • Chamber Crack Propagation study
  • Electro Thermal Analysis
  • Heating and cooling phase Design / Analysis for an Electrostatic Chuck
  • CFD Thermal Analysis of Quartz tube
  • Chemical Etch Rate Prediction
  • Modeling of Electrochemical Reduction
  • Simulation of Electronic Box Cooling
  • Maximize Air Flow within the Electronic Box
  • CFD analysis in MEMS chamber
  • Solder paste simulation joining connector and PCB Board
  • Electrostatic chuck simulation

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